I bought a spray called Plastik70, intended to protect circuit boards from moisture etc.
It is said to be "Quick drying, colourless transparent, flexible, UV light resistant", so it seems to satisfy requirements for an encapsulant.
I sprayed it on a cell, and with a simple setup did not detect a decrease in output power. My next step will be to spray some on a plexiglass piece, some on a cell and see if I can bond them without air bubbles.
Has anyone tried a compound like this as an encapsulant?
The only possible downside that i can see is that it has a temperature limit of between 60 and 100
It is said to be "Quick drying, colourless transparent, flexible, UV light resistant", so it seems to satisfy requirements for an encapsulant.
I sprayed it on a cell, and with a simple setup did not detect a decrease in output power. My next step will be to spray some on a plexiglass piece, some on a cell and see if I can bond them without air bubbles.
Has anyone tried a compound like this as an encapsulant?
The only possible downside that i can see is that it has a temperature limit of between 60 and 100
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